Patents
Methods for wafer bonding and for nucleating bonding nanophases using wet and steam pressurization
N Herbots, S Whaley, R Culbertson, R Bennett-Kennett, A Murphy, … 2017
US Patent 9,589,801 (Granted 2017)
Methods for wafer bonding, and for nucleating bonding nanophases
N Herbots, R Bennett-Kennett, A Murphy, B Hughes, A Acharya, C Watson, …
US Patent 9,418,963 (Granted 2016)
Methods for wafer bonding, and for nucleating bonding nanophases
N Herbots, RJ Culbertson, J Bradley, MA Hart, DA Sell, SD Whaley
US Patent 9,018,077 (Granted 2015)
Methods for preparing semiconductor substrates and interfacial oxides thereon
Patent number: 7851365 Filed: April 27, 2007 Date of Patent: December 14, 2010
Nicole Herbots, James Bradley, Justin Maurice Shaw, Robert J. Culbertson, Vasudeva Atluri (Granted 2010)
#5 Long range ordered semiconductor interface phase and oxides
N Herbots, VP Atluri, JD Bradley, B Swati, QB Hurst, J Xiang
US Patent 6,613,677 (Granted 2003)
